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KMID : 0358920070340040623
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Journal of the Korean Academy of Pedodontics
2007 Volume.34 No. 4 p.623 ~ p.631
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EFFECT OF SOFT-START CURING ON THE CONTRACTION STRESS OF COMPOSITE RESIN RESTORATION POLYMERIZED WITH LED AND PLASMA CURING UNIT
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Chung Yang-Seok
Lee Nan-Young
Lee Sang-Ho
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Abstract
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Effect of Soft-start curing on the contraction stress of composite resin restoration polymerized with LED and plasma curing unit The purpose of this study was to evaluate the influence of soft-start light curing on contraction stress and hardness of composite resin. Composite resin (Filtek , 3M ESPE, USA) was cured using the one-step continuous curing method with three difference light sources ; conventional halogen light (, 3M ESPE, USA) cure for 40 seconds at , LED light (Elipar Freelight , 3M-ESPE, USA) cure for 20 seconds at a and plasma arc light (, LOKKI, France) cure for 12 seconds at . For the soft-start curing method ; LED light (Elipar Freelight , 3M-ESPE, USA) cure exponential increase with 5 seconds followed by 17 seconds at and plasma arc light (, LOKKI, France) cure 2 seconds light exposure at followed by 11 seconds at . The strain guage method was used for determination of polymerization contraction. Measurements were recorded at each 2 second for the total of 800 seconds including the periods of light application. Obtained data were analyzed statically using Repeated measures ANOVA, One way ANOVA, and Tukey test. The results of present study can be summarized as follows: 1. Composite resin restoration showed transient expansion just after irradiation of curing light. Contraction stress was increased rapidly at the early phase of polymerization and reduced slowly as time elapsed (P<0.05). 2. Contraction stress was not revealed significant difference between Halogen curing light groups and LED and Plasma Light curing with soft-start group (P>0.05). 3. LED and Plasma Light curing with soft-start showed lower contraction stress than the one-step continuous light curing (P<0.05).
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KEYWORD
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Soft-start light curing, Contraction stress, Plasma curing unit
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